发明名称 |
High speed jet soldering system |
摘要 |
Continuous jetting of liquid metal droplets for deposit on a substrate includes an ejector, a deflection device, a print chute, and a collection reservoir. Liquid metal from a cartridge in the ejector provides a continuous molten material stream through an orifice-defining structure while a vibration device creates a standing wave in the stream to break the molten material stream into individual droplets which receive charge from a charging device. The deflection device enables the positioning of the charged droplets to be controlled for placement on a substrate. Control systems assist in the calibration and control of the continuous stream to ensure that selected droplets are placed at desired locations on the substrate. |
申请公布号 |
US6224180(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US19970803758 |
申请日期 |
1997.02.21 |
申请人 |
PHAM-VAN-DIEP GERALD;MUNTZ E. PHILIP;WATTS HAL;JOHNSON WILLIAM;MAIN MELVIN;SMITH ROBERT F.;ORM&EACUTE,-MARMARELIS MELISSA E. |
发明人 |
PHAM-VAN-DIEP GERALD;MUNTZ E. PHILIP;WATTS HAL;JOHNSON WILLIAM;MAIN MELVIN;SMITH ROBERT F.;ORM&EACUTE,-MARMARELIS MELISSA E. |
分类号 |
B05B1/02;B05B5/025;B05B17/06;B23K3/06;(IPC1-7):B41J3/00 |
主分类号 |
B05B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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