发明名称 High density plasma nitridation as diffusion barrier and interface defect densities reduction for gate dielectric
摘要 A method of constructing a gate dielectric on a semiconductor surface includes cleaning a silicon surface then growing a silicon nitride barrier layer on the silicon surface using a high density plasma (HDP) of nitrogen. A gate dielectric layer is then deposited on the silicon nitride layer and a second silicon nitride layer is then grown on the dielectric layer, also using an HDP nitrogen plasma, followed by deposition of the conductive gate layer. The HDP nitrogen plasma is heated using an inductively coupled radio frequency generator. The invention also includes a gated device including a gate dielectric constructed on a semiconductor surface by the method of the invention.
申请公布号 US6225169(B1) 申请公布日期 2001.05.01
申请号 US20000512193 申请日期 2000.02.24
申请人 NOVELLUS SYSTEMS, INC. 发明人 CHEW KOK HENG;VAN CLEEMPUT PATRICK
分类号 H01L21/28;H01L21/306;H01L29/51;(IPC1-7):H01L21/336 主分类号 H01L21/28
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