发明名称 |
Flip-chip type semiconductor device |
摘要 |
A flip-chip type semiconductor device has a semiconductor chip mounted on a substrate via a plurality of bumps. The gap between the substrate and the chip is filled with an underfill material and sealed along sides thereof with a fillet material. The underfill material is a cured epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, having a coefficient of expansion of 20-40 ppm/° C. below its Tg. The fillet material is a similar cured epoxy resin composition having a coefficient of expansion of less than 20 ppm/° C. below its Tg. The device is highly reliable.
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申请公布号 |
US6225704(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US20000499022 |
申请日期 |
2000.02.07 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SUMITA KAZUAKI;KUMAGAE KIMITAKA;WAKAO MIYUKI;SHIOBARA TOSHIO |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L23/29 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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