| 摘要 |
The purpose of the present invention is to reduce the warpage of the semiconductor package caused by thermal contraction. According to the present invention, semiconductor device (9) has plate-shaped member (7) which is positioned on a surface of semiconductor chip (1) and is sealed together with semiconductor chip (1) with molding resin (8). Said plate-shaped member (7) has a linear expansion coefficient that is less than the linear expansion coefficient of the aforementioned molding resin. By placing a plate-shaped member with a small linear expansion coefficient on semiconductor chip (1), it is possible to reduce the thermal contraction on the upper side of the semiconductor chip. Also, the presence of the plate-shaped member on the semiconductor chip leads to substantial reduction in the thickness of the molding resin on the semiconductor chip. The pulling force due to contraction of the molding resin that leads to warping is proportional to the thickness of the molding resin. Consequently, by using semiconductor device (9) of the present invention that contains the aforementioned plate-shaped member, it is possible to reduce the warpage of the package to a very low level. |
