发明名称 |
Oxygen plasma resistant polymer for electrical devices |
摘要 |
In one embodiment, the present invention relates to a substrate for an electrical device including a coating, wherein the coating comprises an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a component for an electrical device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In yet another embodiment, the present invention relates to a microelectronic device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor.
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申请公布号 |
US6224979(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US20000664235 |
申请日期 |
2000.09.18 |
申请人 |
RELIANCE ELECTRIC TECHNOLOGIES, LLC |
发明人 |
RYANG HONG-SON;CHUNG YOUNG JIN;SNYDER, II JOSEPH T.;SUNG AN-MIN JASON |
分类号 |
C08F2/44;C08F2/46;C08F4/06;C09D4/00;C09D4/06;C09D167/06;H01B3/44;(IPC1-7):B32B15/00 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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