发明名称 Oxygen plasma resistant polymer for electrical devices
摘要 In one embodiment, the present invention relates to a substrate for an electrical device including a coating, wherein the coating comprises an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a component for an electrical device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In yet another embodiment, the present invention relates to a microelectronic device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor.
申请公布号 US6224979(B1) 申请公布日期 2001.05.01
申请号 US20000664235 申请日期 2000.09.18
申请人 RELIANCE ELECTRIC TECHNOLOGIES, LLC 发明人 RYANG HONG-SON;CHUNG YOUNG JIN;SNYDER, II JOSEPH T.;SUNG AN-MIN JASON
分类号 C08F2/44;C08F2/46;C08F4/06;C09D4/00;C09D4/06;C09D167/06;H01B3/44;(IPC1-7):B32B15/00 主分类号 C08F2/44
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