Lead frame design for reduced wire sweeping

摘要

Wire sweep/crossing during resin molding is significantly reduced or prevented by reducing the gap spacing between corner lead pins and the tie bars of a die-attach pad. Embodiments of the present invention include spacing the tie bars from the corner lead pins by a distance no greater than about 18 mils, e.g., about 4 to 12 mils. Embodiments of the present invention also comprise a lead frame wherein the inner ends of the lead pins are arranged in a substantially planar array to define a substantially circular region surrounding the die-attach pad.