Resin composite and process for producing the same

摘要

A composite resin and fillers for molding electronic and structural parts that have high dimensional accuracy, are free of surface defects stemming from the mold and are suitable for mass production. The preferred composite contains 10 to 70 vol-% of a thermosetting resin with the balance consisting of filler particles having an average diameter of 40 mum or less. The final molded article has pores of 15 to 80 mum in diameter occupying between 3 and 30% of the area of a cross-section.