| 摘要 |
Disclosed is an adhesive resin composition for bonding semiconductor chips comprising an epoxy resin component, a curing agent, a diluent, a curing promoter, a thixotropic agent, and an inorganic filler component. The resin component is approximately 10-50% by weight, and the inorganic filler component is approximately 50-90% by weight and comprises a copper ingredient and a silver ingredient. The copper ingredient is selected from the group consisting of CuO, Cu2O, with the mixtures thereof being approximately 0.1-50% by weight based on the total weight of said inorganic filler component. The silver ingredient is approximately 50-99.0% by weight based on the total weight of the inorganic filler ingredient.
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