| 摘要 |
Removable photoresist sidewall spacers are formed on side surfaces of device features, such as gate electrodes, enabling simplifying CMOS methodology by reducing the number of critical masks and processing steps. Embodiments included angular exposure of a photoresist layer using the device feature to shadow the photoresist on the side surface, thereby preventing exposure such that the unexposed photoresist portion is not removed during subsequent development. Embodiments of the present invention also include forming removable, photoresist sidewall spacers on the side surfaces of the gates of NMOS and PMOS transistors, forming moderately or heavily doped source/drain implants, activation annealing to form moderately or heavily doped source/drain regions, ion implanting shallow source/drain extensions and halo regions and activating the shallow extensions and halo regions.
|
