| 摘要 |
A chemical mechanical planarization process employs a microreplicated surface comprising a regular array of precisely shaped three-dimensional structures such as pyramids, cones, or cube-corners. In a preferred embodiment, asperities of the microreplicated surface employed in an advancing linear belt are allowed to ablate during processing, effectively resulting in a two-phase grinding/polishing operation that increases the material removal rate and increases workplace throughput.
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