发明名称 |
Assembly process for flip chip package having a low stress chip and resulting structure |
摘要 |
A method for assembling a flip-chip package having a low stress chip comprises providing a laminate chip carrier having a chip electrically connected thereon, applying the underfill material between the chip and the laminate chip carrier, providing a cover plate and applying an adhesive to the cover plate or chip or both, placing the cover plate adjacent to the chip such that the adhesive contacts the chip and the cover plate, and curing the underfill material together with the adhesive. The resultant flip-chip package has low internal stress and experiences enhanced fatigue life during thermal cycling.
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申请公布号 |
US6224711(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US19980140077 |
申请日期 |
1998.08.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CARDEN TIMOTHY F.;ZUBELEWICZ ALEKSANDER |
分类号 |
H01L21/56;(IPC1-7):B32B31/00;H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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