发明名称 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
摘要 For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3 . The sheets and foils are guided during transportation past at least one electrode arrangement, which comprises respectively cathodically polarized electrodes 6 and anodically polarized electrodes 7 , the cathodically and anodically polarized electrodes also being brought in contact with the treatment fluid. The cathodically polarized electrodes and the anodically polarized electrodes are connected to a current/voltage source 8 , so that a current flows through the electrodes 6, 7 and the electrically conductive surfaces 4.
申请公布号 AU1381801(A) 申请公布日期 2001.04.30
申请号 AU20010013818 申请日期 2000.10.05
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 EGON HUBEL
分类号 C25D7/06;C25D5/00;C25D5/18;C25D17/00;C25D17/28;C25D19/00;C25F7/00;H05K3/24 主分类号 C25D7/06
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