| 摘要 |
A semiconductor device according to the invention of the present application comprises a substrate having a surface on which interconnections are formed, a semiconductor element connected to the interconnections and mounted on the substrate, and a conductive map for covering the semiconductor element electrically connected to a ground potential. Owing to the provision of the conductive cap for covering the semiconductor element in this way, the semiconductor device can prevent the emission of an electromagnetic wave to the outside and can be prevented from malfunctioning due to an external electromagnetic wave.
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