发明名称 MANUFACTURING OF SEMICONDUCTOR ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible semiconductor element, especially a solar battery, light in weight at a low cost with a simple device. SOLUTION: In this method for manufacturing the semiconductor element, a porous layer 2 is formed on a substrate 1, semiconductor layers 3, 4 and 5 are formed on the porous layer, a supporting substrate 11 is adhered to the semiconductor layers and then the substrate is peeled off at the part of the porous layer. Silica-containing layers 13 and 54 are formed by applying solution containing silica to the surface of the semiconductor layer 3 where the substrate is peeled off and protective films 13 and 54 composed of silicon oxide are formed by irradiating the silica-containing layers with ultraviolet rays and oxidizing the silica in the silica-containing layers by generated ozone.</p>
申请公布号 JP2001118758(A) 申请公布日期 2001.04.27
申请号 JP19990292900 申请日期 1999.10.14
申请人 SONY CORP 发明人 MATSUSHITA TAKESHI;MIZUNO SHINICHI
分类号 H01L51/42;H01L21/02;H01L31/04;(IPC1-7):H01L21/02 主分类号 H01L51/42
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