| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil with insulating resin in which fluidity can be regulated later conveniently even for a coating process of predetermined conditions, and to provide a production method of multilayer printed wiring board using it. SOLUTION: A UV-curing and thermosetting insulating resin layer is formed on one side of a copper foil to produce insulating resin with copper foil which is irradiated with UV-rays, immediately before hot press, in order to impart fluidity required for making uniform the thickness of the insulating resin layer after hot press thus producing a multilayer printed wiring board. |
