| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board which is provided with metallic bumps having uniform heights. SOLUTION: A tip of a metallic bump 16 and a resin film 23 on the mettallic bump 16 are removed by grinding, and a conductor part 14 is left inside a hole 24 and a connection part 7 is grown on its surface by plating method. A new metallic bump, 6 composed of the conductor part 14 and connection part 7, is uniform in height without being effected by variations of height of the originally formed metallic bump 16.
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