| 摘要 |
PROBLEM TO BE SOLVED: To improve the fitting a accuracy of a probe and the hit of the probe to an electrode when a probe inspection device is generated and to perform a stable total inspection of chips on a wafer, when electrical inspection of the semiconductor chips with metal bump electrodes for liquid crystal driver and electrode pitches are made to be fine. SOLUTION: Aluminum pad electrodes for electric inspection 8, which are connected to metal bump electrodes 1a on a silicon chip 2, are installed. By not forming metal bumps in inspection electrodes but inspecting in aluminum pad state, inspection can be executed, without having to develop new facilities. Since the aluminum pad electrodes 8 are arranged on the silicon chip 2 at positions which are not related to junctions with a tape carrier, they can be arranged on the chip at rough pitches with respect to the metal bump electrodes 1a and accordingly stable inspection can be executed. |
