发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To micronize a high breakdown voltage MOS transistor. SOLUTION: There are provided a first power-source line (N+type source layer 30), which is formed on a semiconductor substrate 1, applied with a first voltage (Vdd), and a second power-source line (gate electrode 18D), which is formed on an element isolation film 11 which is so formed as to adjoin the first power-source line, applied with a second voltage (Vg) different from the first voltage, in parallel. Here, since an inter-layer insulating film 38 is present between the element separation film 11 and the second power source line, no conventional guard band layer is required under the inter-layer insulating film 38.
申请公布号 JP2001118926(A) 申请公布日期 2001.04.27
申请号 JP19990298641 申请日期 1999.10.20
申请人 SANYO ELECTRIC CO LTD 发明人 AOYAMA MASASHIGE
分类号 H01L21/768;H01L21/822;H01L21/8234;H01L23/522;H01L27/04;H01L27/08;H01L27/088;H01L29/78;(IPC1-7):H01L21/768 主分类号 H01L21/768
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