| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding material for sealing which is high in adhesion to an insert and excellent in reflow cracking resistance, moisture resistance, and reliability, easily packed for shipping, and easily controlled in moisture absorption, in a process where an electronic device such as a semiconductor device is manufactured, a method of manufacturing the same, and an electronic part device equipped with an element sealed up with the same. SOLUTION: A molding material for sealing is composed of integral components such as an epoxy resin, a hardening agent, and a filler. All the components are heated, kneaded, then cooled down, and subjected to aging and/or heating/kneading for the formation of a molding material for sealing. A method of manufacturing the molding material for sealing and an electronic part device equipped with an element sealed up with the above molding material for sealing are provided.
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