| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module which can be miniaturized while plly securing isolation between bear chips. SOLUTION: Two die pads 2 are installed separately on the surface 1A of a substrate 1, and two ground patterns are installed at a rear face by making them face the die pads 2. The die pads 2 and the ground patterns are connected through the conductive films 4A of through-holes 4. Plural end face through-holes 5 are formed at the outer peripheral edges of the substrate 1, and surface electrodes 6 are formed at the peripheries of the end face through holes 5. Bare chips 8 are jointed to the respective die pads 2 and the input/output terminals of the bare chips 8 are connected to the surface electrodes 6 through wire bondings 9. The ground patterns are mutually connected by a connection line 10, having a length dimension which is quarter of the wavelength of an input/output signal. |
