| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module and an electronic module with a connector, which can efficiently cool electronic components fitted to the upper/ lower faces of a substrate. SOLUTION: In an electronic module, a plurality of first electronic components 52 are fitted to the upper face of a card-like substrate 51, a first heat sink plate 53 is stuck to the upper faces of two or above first electronic components 52 in common, a plurality of second electronic parts 54 are stuck to the lower face of the substrate 51 and a second heat sink plate 55 is stuck to the lower faces of two or more second electronic components 54 in common. Heat generated by the high speed operations of the first electronic components 52 and the second electronic components 54 is discharged to the air, through the first heat sink plate 53 and the second heat sink plate 55. An electronic module with connector is installed on a connector, having a housing means holding the electronic module substantially parallel to a mother board and a ventilation means which, is installed in the housing means and through which air passes along the electronic module. |
