| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, where an optional number of semiconductor chips can be laminated without increasing the device in two-dimensional size, and a lead time can be also shortened. SOLUTION: A semiconductor device 1 is equipped with a board 10 provided with a wiring pattern 11 formed on its one surface and a semiconductor chip 2 formed on the same surface of the board 10 and electrically connected to the wiring pattern 11, where joints between the semiconductor chip 2 and the wiring pattern 11 are sealed up with resin, a part of the wiring pattern 11 is extended protruding from the board 10 and a package (resin-sealed part) 3 to serve as a lead 11a, and a solder ball 4 is provided to the tip of the lead 11a. |
