| 摘要 |
PROBLEM TO BE SOLVED: To provide a pellet pick-up device which removes even a thin, fragile semiconductor pellet pasted to an adhesive sheet from it with no flaw, chip, or breakage. SOLUTION: While a pellet 3 pasted to an adhesive sheet 1 is sucked and held with a collet 4, the adhesive sheet is sucked to a sucking opening provided at a stage. In this state, the stage 8 advances straight or rotates in a horizontal plane so that the adhesive sheet 1 is removed from the pellet 3. Then the collet 4 sucks and carries the pellet 3 to a specified position. Since the pellet 3 is not pushed up with a needle as before, no flaw, chip, or breakage takes place with the pellet 3 even if it is thin or fragile. |
