| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for supplying treating liquid by which the used amount of a treating liquid can be reduced and, in addition, can reduce the amount of the treating liquid left on the surface of an object to be treated. SOLUTION: A method for supplying treating liquid includes a step of supplying a polymer removing liquid to the whole surface of a wafer W while the wafer W is made to stand still, a step of leaving the wafer W in the standing still state for 2-10 seconds, and a step of flinging away the polymer removing liquid and removed polymer from the wafer W by rotating the wafer W. The method also includes a step of stopping the rotating wafer W and holding the wafer W in the stopping state for 2-5 seconds, a step of supplying the polymer removing liquid to the whole surface of the wafer W while the wafer W is rotated, and a step of stopping the rotating wafer W and leaving the wafer W in the stopping state for 2-10 seconds. In addition, the method also includes a step of flinging the polymer removing liquid and removed polymer from the wafer W by rotating the wafer W. |
