| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin paste substituted for a solder, which is of excellent in conductivity as well as in heat dissipation. SOLUTION: A conductive resin paste comprises atomized silver powder whose tap density is 4.5 g/cm3 or higher while average particle size is 3-20 μm, fine globular silver powder whose average particle size is 0.8-2.2 μm hydroxyalkylacrylic acid or methacrylic acid, urethane diacrylate or methacrylate provided through reaction between polyalkylene glycol and diisocyanate, monoacrylate or monomethacrylate, organic peroxide, and other silver. Here, the total silver content in the conductive resin paste is 80-92 wt.% while urethane diacrylate/monoacrylate is 0.6-2.1. The semiconductor device is manufactured using the conductive resin paste. |
