发明名称 CONNECTING DEVICE OF FRAME GROUND
摘要 PROBLEM TO BE SOLVED: To reinforce the ground of electronics, to protect the electronics from the noise of static electricity, etc., that disturbingly invades from outside of the electronics, and from the internal noise of mainly high frequency that is generated from the inside of the electronics, and to prevent the electronic system down and troubles due to the noises, and in addition to reinforcing of a printed- circuit board in order to stabilize the movement of the electronics as well. SOLUTION: Characteristic compositions are that a board witch has enough thickness to reinforce printed-circuit boards 3, 23 are provided, that at least a surface layer part (plating layer 11 i) has electro-conductivity, that the ground 3a of printed-circuit boards 3, 23 of the inside of the electronics 2 and a grounded frame 6 at the outside of the electronics 2 are mounted so that they are made conductive with each other, and that the high frequency noise is discharged through a surface layer part owing to a noise-absorbing boards 11, 12 having a great cross section of electro-conductivity in the surface layer part.
申请公布号 JP2001118613(A) 申请公布日期 2001.04.27
申请号 JP19990295892 申请日期 1999.10.18
申请人 FUJI ELECTRIC CO LTD 发明人 ITO SHINKICHI
分类号 H01R4/64;H05F3/02;(IPC1-7):H01R4/64 主分类号 H01R4/64
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