| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet exhibiting excellent workability in producing a multilayer printed wiring board having fluidity to fill the gap between circuit conductors of an inner circuit completely, a uniform low coefficient of thermal expansion and a reasonable rigidity, and to provide a production method of the adhesive sheet and a multilayer printed wiring board using the adhesive sheet. SOLUTION: An adhesive sheet comprises a copper foil or a carrier film and an insulating resin layer containing two kinds or more of filler having different shape. The adhesive sheet is produced by coating one side of a copper foil or a carrier film with resin varnish, produced by dispersing two kinds or more of filler having different shape into thermosetting resin, and then semicuring it thermally. A multilayer printed wiring board contains two kinds or more of filler having different shape in a layer insulating an inner layer circuit and an outer layer circuit. An adhesive sheet dispersed with two kinds or more of filler having different shape is laid on an inner layer circuit board to touch the resin and integrated by hot press and then via holes are made and an outer layer circuit is formed thus producing a multilayer printed wiring board. |
