| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting of a semiconductor element which can operate at a high speed with a large operational margin, by increasing a noise absorbing effect caused by connection of a capacitor element to a power terminal of the semiconductor element. SOLUTION: In a semiconductor element 2, a semiconductor substrate connection terminal 5 provided on a wiring board 3 and a substrate connection terminal 2a of a semiconductor element 2 are mounted on the board 3 as connected to each other by a solder chip 2b. The wiring substrate 3 is made of a capacitor element part 4, the semiconductor element connection terminal 5 and a plurality of insulating layers 6. The semiconductor element 2 has such a shape that a multiplicity of the substrate connection terminals 2a arranged on its lower surface in a lattice form, and a multiplicity of semiconductor element connection terminals 5 are provided on the wiring board 3 to correspond to the substrate connection terminals 2a of the semiconductor element 2. The element connection terminals 5 are any of a power firing 7b, a grounding wiring 7a and signal wiring 7c extended in a direction passing through the board 3 directly thereunder respectively. A circular capacitor element part 4 including electrodes 4a, 4c and an insulating layer 4b is formed around the power wiring 7b.
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