| 摘要 |
PROBLEM TO BE SOLVED: To provide an LSI package and its observing method capable of easily and directly as much as possible observing an internal signal waveform of an LSI chip. SOLUTION: In this LSI package provided by packaging the LSI chip 1, for example, a residual I/O pad in the LSI chip 1, namely an I/O pad unconcerned with functions realized by the LSI chip 1, is employed as a waveform monitor pad 7, and a residual package pin in this LSI package, namely a package pin unconcerned with functions realized by the LSI chip 1, is employed as a waveform monitor pin. To be specific, an observation point 9 and the waveform monitor pad 7 are electrically connected by wiring 8, and the waveform monitor pad 7 and the waveform monitor pin are electrically connected.
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