发明名称 POSITIVE PHOTORESIST COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY
摘要 PROBLEM TO BE SOLVED: To obtain a positive photoresist composition for exposure with far UV excellent in shelf stability and free from the occurrence of development defects in development. SOLUTION: The positive photoresist composition contains a compound which generates an acid when irradiated with active light or radiation, a polymer having repeating units with a specified structure and repeating units with a specified structure having an alicyclic ring in the principal chain and having a group which is decomposed by the action of the acid and a mixed solvent containing at least one selected from the group comprising butyl acetate and propylene glycol monoalkyl ether carboxylates and at least one selected from the group comprising ethyl lactate and propylene glycol monoalkyl ethers.
申请公布号 JP2001117234(A) 申请公布日期 2001.04.27
申请号 JP19990298782 申请日期 1999.10.20
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO;ADEGAWA YUTAKA;AOSO TOSHIAKI
分类号 H01L21/027;G03F7/00;G03F7/004;G03F7/039 主分类号 H01L21/027
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