| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer printed board in which the transmission speed of signal is increased by preventing wiring delay of the multilayer printed board at the signal transmission and reliability of the multilayer printed board is enhanced by preventing a wiring material from being diffused into an insulation film to cause short circuit of wiring. SOLUTION: The multilayer printed board P comprises copper film wiring patterns B1, B2, B3 and insulation film patterns D1+E1, D2+E2 laminated alternately on a board body A. Barrier layers C1, C2, F1, F2 for preventing diffusion of copper into the insulation film patterns are formed between the copper film wiring patterns B1, B2, B3 and insulation film patterns D1+E1, D2+E2. The insulation film patterns D1+E1, D2+E2 are formed of a photosensitive organic insulation film having a low permittivity (specific permittivity of 3.5 or below) and exhibiting variable etching characteristics at a part being irradiated with light or plasma. |
