| 摘要 |
PROBLEM TO BE SOLVED: To make solderable the tip of a coil by thermocompression bonding while accurately and speedily positioning the coil tip on a land formed on a printed wiring board. SOLUTION: An the corner parts of a printed wiring board 16, lands 18 are formed crossing the corner parts, and the coil tips 13a of an antenna coil are soldered to the lands 18. That is, when the tip of a thermocompression bonding machine is pressed against a land 18 while a coil tip 13a led linearly out of the antenna coil 13 is positioned on the land 18 where solder is applied to, the tip of the thermocompression bonding machine generates heat to fuse the solder applied to the land 18, so the coil tip 13a can be soldered to the land 18. In this case, the coil tip 13a can be positioned on the land 18 without interfering with an IC chip 17, so the work efficiency is improved. |
