| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which can be protected against chipping or cracks which occurs in its part that is not sealed up with sealing resin when stress is applied from the outside in such a case where it falls off to hit the floor, because its surface where bumps are not provided is not sealed with resin when the semiconductor device is mounted in a flip chip mounting manner. SOLUTION: A semiconductor chip 11 mounted in a flip chip mounting manner is sealed up with first sealing resin and second sealing resin. Therefore, even if stress is applied from outside, the semiconductor chip 11 can be protected against crack or chipping, so that a semiconductor device of high reliability can be obtained. |
