| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method by which such a multiple chip element can be manufactured at a low cost that can be packaged at a high density by reducing the distances between chip elements, and can be constituted by combining various kinds of chip elements requested by a customer with each other. SOLUTION: Chip elements 2 which are adjacently arranged in parallel with each other by positioning the elements 2 by using pins N which are put in notched sections 4A formed on electrodes 4 are fixed to each other by sticking a tape-like fixing material 7 to the elements 2, and melting and sticking the material 7 to the elements 2 through heat treatment.</p> |
