PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition having high sandblast resistance and excellent in handleability owing to the lowering of the peeling strength of a protective film when it is formed as a dry film resist. SOLUTION: The photosensitive resin composition contains a carboxyl- containing urethane (meth)acrylate compound (A) having 10-150 mgKOH/g acid value, a photopolymerization initiator (B) and a hydroxy-fatty acid or its derivative (C). Preferably the composition further contains a urethane (meth)acrylate compound (D) having no acid value.