| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-receiving element array chip, in which the size and the pitch of the light-receiving element array can be miniaturized and the chip size per the number of the light-receiving elements can be miniaturized. SOLUTION: On the side of a light-receiving element array, eight pieces of light-receiving elements are arranged in a single block, and a bonding pad Bi to which an n-type electrode 42 of each light-receiving element is commonly connected is formed. If the number of the light-receiving elements is 128, i=1-16, whereas wiring Lj (j=1 to 8) to which p-type electrodes 40 of the light-receiving elements of the eight pieces are connected and eight bonding pads B(Lj) that are connected to the respective wiring are formed. The light-receiving-element array is of a mesa structure.
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