DISSIPATORE DI CALORE A FLUIDO PER COMPONENTI ELETTRONICI

摘要

A fluid-cooled heat sink for electronic components comprises a first metal plate (2) designed to be positioned in contact with at least one electronic component (5) and a second plate (6) having a first face (7) and a second face (8). The first face (7) of the second plate (6) is joined to the first plate (2). The first face (7) of the second plate (6) has made in it a groove (9) for a cooling liquid (10). The first face (7) and the second face (8) of the second plate (6) are parallel at least along the length of the groove (9).