| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling between a lead wire and synthetic resin, improve the appearance and reduce the amount of synthetic resin by reducing the space for storing bond with respect to a sealing construction of the lead wire leading out part in an electronic device, in which the part of a waterproof case through which the lead wire passes, is sealed with synthetic resin. SOLUTION: A part 21, through which a lead wire passes is provided with a tube 2 for guiding the lead wire, an air vent 4 and a hole 5 into which synthetic resin for sealing is injected, and a wall 6 is provided for surrounding the lead wire guiding part, the air vent and the hole.
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