| 摘要 |
PROBLEM TO BE SOLVED: To provide a module structure which is excellent in heat dissipating properties and reliability. SOLUTION: A module structure assembly jig brings a ceramic circuit board mounted with an electric part into close contact with a heat dissipating part such as heat radiating fins or heat radiating blocks by pressing them by the part of its surface with a fixing jig. The above fixing jig is provided with four threaded holes each bored in its four corners for being mounted on the heat dissipating part, and furthermore equipped with a rib structure which is located outside of the threaded holes protruding toward the heat dissipating part, and a module structure is provided with the same.
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