| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure for an electronic component which relaxes uniformity of the heat density distribution generated and electronic apparatus and improves the cooling efficiency of the electronic component. SOLUTION: This cooling unit has a heat transfer plate 15, to which a high- heating-value processor 14a mounted on a board 14 transfers heat and radiation fins 16, 17 heat mounted transferrably on the heat transfer plate 15, the radiation fins 16, 17 extend to a low-heating value heating element 14b having a lower heating value than that of the processor 14a mounted on the board 14, thereby radiating at least a part of the heat transferred from the processor near the low-heating value element 14b, and thus the cooling efficiency of an electrical element can be raised, by relaxing the generated heat density difference between near the processor 14a and near the low-heating value element 14b, even when the electrical element is disposed in a limited space. |
