| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board superior in insulating reliability and connection reliability, in which there is little unevenness of processing on a conductor circuit for a multilayer wiring board of which a fine circuit is formed by a simple method. SOLUTION: In this method of manufacturing a wiring board, by which wiring is formed by plating on a surface where an insulating layer is roughened, heat treatment is performed after plating. |
