| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board that is filled sufficiently in a point containing no internal layer circuit and has superior accuracy in the thickness of an insulating layer, and a method of manufacturing it. SOLUTION: The multilayer printed wiring board is manufactured by the method in which resin powder is stuck to only a point containing no circuit in an internal layer circuit board, and a pre-preg and a metal foil are piled thereon, and the point is heated and pressurized to laminate and unit in a body. |
