| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor integrated circuit device of a structure, where a deformations of bumps which work at the time of the operation and stop of a semiconductor integrated circuit, are reduced. SOLUTION: Surface outward bending regidity of the outer peripheral part of a chip of a semiconductor integrated circuit is set smaller, in comparison to the rigidity of the interior of the chip and concentration of a deformation into bumps at the operation of the integrated circuit is absorbed in the outer peripheral part of the chip.
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