| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for SMT repairing in which warpage of a printed board mounted with components on both surfaces thereof is prevented. SOLUTION: A stage, that has a plurality of holes and is provided with a warpage-preventing pin in a specified hole, which avoids a mounted component when the stage is brought into contact with the printed board, is provided in advance, and a hot air nozzle is so put on the printed board as to enclose an SMT component, and the printed board is supported by the stage from the reverse side surface, and heated air is blown onto the SMT component from the hot air nozzle to melt solder, and then the SMT component is detached from the printed board with a suction nozzle, in the method for SMT repairing. The device for SMT repairing is provided with the stage having a plurality of holes and the warpage-preventing pin that is so provided in the prescribed hole as to avoid the mounted component to support the printed board from the backside in a body with the stage.
|
