NON-INVASIVE ELECTRICAL MEASUREMENT OF SEMICONDUCTOR WAFERS

摘要

A semiconductor wafer probe assembly (10) includes a chuck assembly (18, 20) configured to receive a back surface (30) of a semiconductor wafer (14) and an electrical contact (20) for contacting the semiconductor wafer (14). A probe (36) having an elastically deformable conductive tip (38) is movable into contact with a semiconducting material forming a front surface (13) of the semiconductor wafer (14) or with a front surface (34) of a dielectric (12) formed on the front surface of the semiconducting material. A tester (82) is connected for applying an electrical stimulus between the electrical contact (20) and the conductive tip (38) for measuring a response to the electrical stimulus and for determining from the response at least one electrical property of the semiconducting material and/or the dielectric (12).