| 摘要 |
<p>A method of forming a microelectronic assembly (10) is disclosed. The method includes the steps of providing an integrated circuit die (12) having a die face (16) and a plurality of solder bumps (22) deposited on a plurality of bond pads (20). The die face (16) is coated with a self-sustaining polymeric layer (28). A substrate (30) is provided having a plurality of bond pads (34), and the die (12) is superimposed over the die face (16) so that each of the solder bumps (22) registers with a corresponding one of the substrate bond pads (34). The die (12) and the substrate (30) are heated to a reflow temperature thereby forming a solder connection (36) between each solder bump (22) and its corresponding substrate bond pad (34) and thereby encapsulating the solder connections so formed in the polymeric layer.</p> |
