CMP SLURRY, POLISHING METHOD, AND CMP TOOL

摘要

PROBLEM TO BE SOLVED: To speedily eliminate copper and to minimize the loss of copper in a patterned interconnected body without eliminating a metal layer and a dielectric layer at a lower side or corroding copper. SOLUTION: The chemical - mechanical polishing(CMP) slurry for polishing the layer of copper or that of the alloy of copper contains an etchant, an oxidation suppression agent, and an additive for adjusting the complexing between the copper and the oxidation suppression agent.