| 摘要 |
The component (1), located inside a corresponding package (P), is associated with a first heat sensor (3), located in proximity to the component (1) inside the package (P), together with a second heat sensor (11). The means of thermal conditioning (4) are controlled in such a way as to keep the temperature of the first sensor (3) at a level identified by a reference signal (rifv). <??>The second sensor (11) is associated with the said package (P) in such a way as to generate a second temperature signal indicating the external temperature, and the aforesaid reference signal (rifv) is modified as a function of the said second temperature signal, providing effective temperature control of the component (1). <IMAGE> |
