发明名称 |
Transponder tag and method of manufacture in which a transponder chip and coil are encased in grout compound on a former to provide a simple and economic production process |
摘要 |
Enclosed transponder has a transponder unit (15) with a chip and a coil. The unit is enclosed using a grout compound (18). Independent claims are made for procedures for transponder production. In the first procedure the chip and coil are deposited on a support and then the droplet type grout is placed on top. In a second one a grout bottom layer (24) is placed on the support and then chip and coil placed on the layer. Before a final sealing grout compound is placed on top. |
申请公布号 |
DE19946254(A1) |
申请公布日期 |
2001.04.26 |
申请号 |
DE1999146254 |
申请日期 |
1999.09.27 |
申请人 |
FINN, DAVID;RIETZLER, MANFRED |
发明人 |
FINN, DAVID;RIETZLER, MANFRED |
分类号 |
G06K19/077;H01L23/31;H01L23/64;H05K5/00;(IPC1-7):H05K1/18;H04B1/59 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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