发明名称 Transponder tag and method of manufacture in which a transponder chip and coil are encased in grout compound on a former to provide a simple and economic production process
摘要 Enclosed transponder has a transponder unit (15) with a chip and a coil. The unit is enclosed using a grout compound (18). Independent claims are made for procedures for transponder production. In the first procedure the chip and coil are deposited on a support and then the droplet type grout is placed on top. In a second one a grout bottom layer (24) is placed on the support and then chip and coil placed on the layer. Before a final sealing grout compound is placed on top.
申请公布号 DE19946254(A1) 申请公布日期 2001.04.26
申请号 DE1999146254 申请日期 1999.09.27
申请人 FINN, DAVID;RIETZLER, MANFRED 发明人 FINN, DAVID;RIETZLER, MANFRED
分类号 G06K19/077;H01L23/31;H01L23/64;H05K5/00;(IPC1-7):H05K1/18;H04B1/59 主分类号 G06K19/077
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