发明名称 METHOD AND DEVICE FOR THE ELECTROLYTIC TREATMENT OF ELECTRICALLY CONDUCTING SURFACES SEPARATED PLATES AND FILM MATERIAL PIECES IN ADDITION TO USES OF SAID METHOD
摘要 The invention relates to the electrolytic treatment of conducting plates and films LP wherein a method and a device are used in which plates and films ar e transported by a treatment unit and thereby brought into contact with a treatment liquid (3). The plates and the films are transported past at least one electrode arrangement consisting of cathode poled electrodes (6) and ano de poled electrodes (7). Said cathode and anode poled electrodes are brought in to contact with said treatment liquid. Said cathode poled electrodes and anode electrodes are connected to an electrical source/voltage source (8) in such a way that electricity flows through said electrodes and electrically conducti ng surfaces (4).
申请公布号 CA2384249(A1) 申请公布日期 2001.04.26
申请号 CA20002384249 申请日期 2000.10.05
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 HUBEL, EGON
分类号 C25D7/06;C25D5/00;C25D5/18;C25D17/00;C25D17/28;C25D19/00;C25F7/00;H05K3/24;(IPC1-7):C25D5/18 主分类号 C25D7/06
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